Research on the Packaging Technology for Integrated Power Electronics Module

Hanhui  Liu

School of Electronic Communication and Physics, Shandong University of Science and Technology, Qingdao, 266590, China

Abstract: Power electronic system integration is a comprehensive project of cross-infiltration of power electronics technology and materials, machinery, chemistry, information and other multi-disciplinary edges. It can realize high power density, high efficiency, high reliability and low cost of power electronic systems and is the important direction of the development of power electronics technology. This paper mainly introduces the key technologies of integrated power electronic module packaging such as membrane technology, substrate technology, package structure and interconnection technology. Based on this, this paper uses flip chip technology to complete the design and packaging of half-bridge FC-IPEM. Finally, the electrical performance of FC-IPEM is tested briefly to provide some guidance for the integration of power electronic systems.

Keywords: Power electronics system integration; Integrated Power electronics module (IPEM); Modeling; Three-dimensional packaging; Flip chip technology (FCT)